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Heat transfer and pressure drop experiments on CMOS compatible microchannel heat sinks for monolithic chip cooling applications

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cris.virtualsource.departmentcb884857-ca98-4c77-8862-00a830d5b59c
cris.virtualsource.department572fff0d-95cf-422e-a988-bbf98c25711f
cris.virtualsource.department70b30ba8-2681-400b-85f8-66a54ec734ec
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cris.virtualsource.orcidcb884857-ca98-4c77-8862-00a830d5b59c
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cris.virtualsource.orcide049e296-45be-4660-9d3e-c2db33ea10b8
dc.contributor.authorAziz Koyuncuoğlu
dc.contributor.authorRahim Jafari
dc.contributor.authorTuba Okutucu-Özyurt
dc.contributor.authorHaluk Külah
dc.contributor.authorJafari, Rahim
dc.date.accessioned2024-07-09T14:15:50Z
dc.date.available2024-07-09T14:15:50Z
dc.date.issued2012-06
dc.identifier.doi10.1016/j.ijthermalsci.2012.01.006
dc.identifier.urihttps://acikarsiv.thk.edu.tr/handle/123456789/1727
dc.publisherElsevier BV
dc.relation.ispartofInternational Journal of Thermal Sciences
dc.relation.issn1290-0729
dc.titleHeat transfer and pressure drop experiments on CMOS compatible microchannel heat sinks for monolithic chip cooling applications
dc.typejournal-article
dspace.entity.typePublication
oaire.citation.volume56
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relation.isAuthorOfPublication.latestForDiscovery8f9a8d52-0d29-4904-a080-3749d39f3ab5

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