Publication:
Evaluation of Fatigue Behavior of Lead-Free Solder Joints in Four-Point Bending Test by Finite-Element Modeling

Simple item page
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtualsource.department20049e3c-c21f-45e4-8c00-facb6a90354f
cris.virtualsource.orcid20049e3c-c21f-45e4-8c00-facb6a90354f
dc.contributor.affiliationInteruniversity Microelectronics Centre; KU Leuven; Turk Hava Kurumu University; Turkish Aeronautical Association; KU Leuven
dc.contributor.authorSabuncuoglu, Baris; Vanhee, Filip; Willems, Geert; Vandevelde, Bart; Vandepitte, Dirk
dc.date.accessioned2024-06-25T11:45:46Z
dc.date.available2024-06-25T11:45:46Z
dc.date.issued2017
dc.description.abstractFatigue performance of solder joints in four-point bending test is evaluated by finite-element modeling. A simplified modeling technique is implemented in order to focus on the behavior of the critical solder joint. The fatigue life is estimated by taking into account the creep behavior of the solder joints and the utilization of Morrow's fatigue model. Fatigue life curves are generated for room temperature and two elevated temperatures with the critical orientation of chip scale packages on the test board. The results are compared with the real four-point bending test conducted for two different temperatures. In addition, some parametric studies are conducted including the significance of test temperature, copper wiring structure, and the dwell time in the cyclic loading profile. Besides these, the structural integrity of the test board is also checked.
dc.description.doi10.1109/TCPMT.2017.2739808
dc.description.endpage1964
dc.description.issue12
dc.description.pages8
dc.description.researchareasEngineering; Materials Science
dc.description.startpage1957
dc.description.urihttp://dx.doi.org/10.1109/TCPMT.2017.2739808
dc.description.volume7
dc.description.woscategoryEngineering, Manufacturing; Engineering, Electrical & Electronic; Materials Science, Multidisciplinary
dc.identifier.issn2156-3950
dc.identifier.urihttps://acikarsiv.thk.edu.tr/handle/123456789/1334
dc.language.isoEnglish
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
dc.relation.journalIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
dc.subjectFatigue; fatigue; finite-element modeling; four-point bending; solder joint reliability
dc.subjectTHERMOMECHANICAL FATIGUE; LIFE PREDICTION; ENERGY DENSITY; RELIABILITY; PACKAGES; SNAGCU; CREEP; DEFORMATION; TEMPERATURE; ASSEMBLIES
dc.titleEvaluation of Fatigue Behavior of Lead-Free Solder Joints in Four-Point Bending Test by Finite-Element Modeling
dc.typeArticle
dspace.entity.typePublication

Files

Collections

WOS - Web of Science